Apple manufacturing companions TSMC has introduced its latest semiconductor course of, superior packaging, and 3D IC applied sciences “for powering the following era of AI improvements with silicon management on the Firm’s 2024 North America Know-how Symposium.
For instance, it debuted A16, which is able to mix the corporate’s Tremendous Energy Rail structure with its nanosheet transistors for deliberate manufacturing in 2026. Based on TSMC CEO C. C. Wei it improves logic density and efficiency by dedicating front-side routing assets to indicators.
In comparison with TSMC’s N2P course of, A16 will present 8-10% pace enchancment, 15-20% energy discount on the similar pace, and as much as 1.10X chip density enchancment for information heart merchandise. You possibly can virtually definitely anticipate to see it in future Apple Silicon merchandise.
